Abstract: Currently lots of fin heat sinks which has been put into use are expensive, when they are used on COM Express(COM-E for short)mainboard in high temperature circumstance of 55℃, mainboard’s heat dissipation is unsatisfactory as assumed. In order to overcome the shortage of commercial heat sinks, the paper detailed analyzed the fin heat sink of COM-E mainboard, proposed a calculate method of single finned radiator’s thermal resistance, based on COM-E mainboard’s quantity of heat, and combined with calculation and simulation on the finned radiator, optimized designs a kind of excellent fin heat sink. Using optimized fin heat sink, ruggedized computer passed the high temperature experiment successfully meanwhile it is working in high speeds.

Key words:  , ruggedized computer； thermal resistance； thermal design； thermal analysis