Recommended Technology for Solder Paste Printing Process Parameters on Data Driven

doi:10.3969/j.issn.1006-2475.2024.01.016

Abstract

Abstract: Abstract： Aiming at the problems of subjectivity and strong dependence on experience in the process of solder paste printing of printed boards， a way to recommend printing process parameters on data driven method is proposed. Firstly， the prediction models of component solder paste printing quality for each component is constructed， which concluded three sub models for each component： printing qualification rate prediction， solder paste relative area/volume prediction， and printing defect type prediction. Then， the recommended model of solder paste printing process parameters for printed board is structure aiming to optimize the printing quality of each component. Finally， the correctness of the models were verified based on the actual printing data， the average accuracy of the prediction of the printing qualification rate reached 99%， the deviation between the recommended process parameters and the empirical value was less than 10%. All these means the results of quality prediction and process parameter recommendation can meet the requirements of practical production and application.

Key words: Key words： solder paste printing, random forest, quality prediction, parameter recommendation

CLC Number:

TN605

SU Xin. Recommended Technology for Solder Paste Printing Process Parameters on Data Driven[J]. Computer and Modernization, 2024, 0(01): 99-102.

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